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Glass wafer,Semiconductor packaging grade glass wafer

Brand: ET
model: ET-001
place of origin: china
Colour: Transparent
Density: 2.2g/cm3
Silica content: 99.99
use: High temperature
Melting point: 1730
Annealing Point 1215
Deformation point 1120
Mohs hardness 7
Coefficient of expansion 5.5
Refractive index 1.4585

1.wrapped with thin white paper .
2.winded with foam material
3.put into the paper carton
4.packed with wooden case

Quantity:

Quartz Wafer01 (4)Quartz Wafer01 (5)Quartz Wafer01 (7)Quartz Wafer01 (8)Quartz Wafer01 (10)Quartz Wafer01 (11)


We can provide customers with high-precision glass wafers with thickness ≧0.1mm and dimensions ≧Φ2", which are used in CMOS, CCD sensors, integrated circuits or micromechanical component packaging (MEMS), communication and data processing, High-tech products such as optics, electronic products, home appliances, military industry, scientific research, etc.


Glass wafer plus technical parameters:


a) Material: Corning E-XG, PYREX7740, quartz glass, BOROFLOAT, B270, D263T, AF32, BK-7

b) Standard thickness: 0.1mm, 0.145mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.1mm, 1.5mm (thickness tolerance ±0.02mm)

c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)


d) Appearance: 60/40; 40/20; 20/10


e) Surface roughness (Ra)<1.5nm


f) Parallelism <0.01mm


Basic properties of Corning E-XG glass wafers:

技术参数:

Density/密度(g/cc

2.3

Thermal Expansion/膨胀系数

3.0

Transmittance/透光率

90%

 softening point/软化点

971

TTV/平整度

<0.005

Bow/翘曲度

<0.01 

Warp/弯曲度

<0.01 

Vickers Modulus/维氏硬度

640

 

Features:


     ●Special glass material application


     ●Experience in polishing field, unique surface quality


     ●Can be used in clean rooms for packaging ready-to-use substrates


     ●Structural wafers with excellent tolerances


     ●Customer-specified products that meet all requirements and industrial standards (such as SEMI)


     ●Integrated production steps that meet all requirements of ISO 9001:2000


typical application:


     ●Micro optics


     ● MEMS (pressure sensor, accelerometer...)


     ● Wafer-level packaging (image sensor packaging...)


     ●Bioengineering (microfluidics, DNA analysis...)


     ●And many other customer specified applications


g) Each edge is blunt C0.05~0.2mm


h) Crack <0.2mm, no internal crack


i) The surface is clean, free of marks and stains, packed in ultra-clean bags or single-piece boxes.



CONTACT US

We mainly do all kinds of quartz glass processing and manufacturing.

QUICK LINK

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CONTACT INFO

 Tel: +86-0518-87795018
 E-mail: linda@et-create.com
 Phone: +86-13775405985
 Add: NO 18, xinniu Road,Niushan Town,Donghai County

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